Soldering and Curing

Reflow Soldering has become the standard technology in the SMT industry worldwide.

All Essemtec ovens are in production for leaded and leadfree boards.

 

Modular Full Convection Reflow Oven
  • 7 to 13 zones
  • Speeds up to 55” per minute
  • Nitrogen option
  • Lowest cost of ownership
  • Chain or belt transport

 

Full Convection Reflow Oven
  • 4 heating zones and 1 cooling zone
  • 16” process width
  • Soldering or curing
  • Chain or belt transport

 

Full Convection Reflow Oven
  • 3 heating zones and 1 cooling zone
  • 12” process width
  • Soldering or curing
  • Chain or belt transport

 

Batch Reflow Oven
  • For prototypes and small batches
  • 15.75 x 11.81” process area
  • Integrated temperature measurement
  • Automatic processing